Posted on Feb 4, 2019

Global SMT & Packaging

The test landscape is changing. SPI, AOI and x-ray systems provide much of the intelligence that drives the production equipment on the factory floor. Future systems will be even more intelligent, gathering more data and include automatic programming and integrated inspection analysis. This panel will discuss what this means for the test engineer? Panel: Satoshi Otaki (SAKI), Brian D'Amico (MIRTEC), Joel Scutchfield (Koh Young), Richard Osborne (OMRON)
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